MCIMX6QP4AVT1AB Product Information|NXP

Features


    Package


    FBGA624: FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body

    Buy Options

    MCIMX6QP4AVT1AB

    Active

    12NC: 935363578557

    Details

    Order

    Order from distributors

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    MCIMX6QP4AVT1AB(935363578557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    2381.425

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    MCIMX6QP4AVT1AB
    (935363578557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
    MCIMX6QP4AVT1AB
    (935363578557)
    854231
    5A992C
    G159000

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    MCIMX6QP4AVT1AB
    (935363578557)
    2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    MCIMX6QP4AVT1AB
    (935363578557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MCIMX6QP4AVT1AB
    (935363578557)
    2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates
    MCIMX6QP4AVT1AB
    (935363578557)
    2019-05-082019-05-09201805041IiMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates