MCIMX6D5EYM12CE Product Information|NXP

Package


LFBGA624: LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MCIMX6D5EYM12CE(935357868557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
1287.1

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MCIMX6D5EYM12CE
(935357868557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MCIMX6D5EYM12CE
(935357868557)
854231
5A992C

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MCIMX6D5EYM12CE
(935357868557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCIMX6D5EYM12CE
(935357868557)
2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates
MCIMX6D5EYM12CE
(935357868557)
2019-05-082019-05-09201805041IiMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates
MCIMX6D5EYM12CE
(935357868557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments