MC17XSF500CEK Product Information|NXP

MC17XSF500CEK

No Longer Manufactured

MC17XSF500CEK

No Longer Manufactured

Package


HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 4.6 mm x 7 mm exposed pad

Buy Options

MC17XSF500CEK

No Longer Manufactured

12NC: 934071659574

Details

Order

MC17XSF500CEKR2

No Longer Manufactured

12NC: 934071659518

Details

Order

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC17XSF500CEK(934071659574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8
MC17XSF500CEKR2(934071659518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC17XSF500CEK
(934071659574)
No
3
260
40
MC17XSF500CEKR2
(934071659518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC17XSF500CEK
(934071659574)
854239
EAR99
MC17XSF500CEKR2
(934071659518)
854239
EAR99

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC17XSF500CEK
(934071659574)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC17XSF500CEKR2
(934071659518)