M83252G13 Product Information|NXP

Features


C1K 533MHz

    Package


    HBGA448: HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body

    Buy Options

    M83252G13

    No Longer Manufactured

    12NC: 935324884557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    M83252G13(935324884557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    No
    G
    e1
    REACH SVHC
    1752.6

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    M83252G13
    (935324884557)
    No
    4
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    M83252G13
    (935324884557)
    854231
    5A002A1

    Discontinued and Replacement Part Data

    Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery Date
    M83252G13
    (935324884557)
    -
    2017-06-01
    2017-12-01

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    M83252G13
    (935324884557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label