KCU860TCZQ50D4 Product Information|NXP

KCU860TCZQ50D4

No Longer Manufactured

KCU860TCZQ50D4

No Longer Manufactured

Features


PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor,-40 to 95C

    Package


    BGA357: BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body

    Buy Options

    KCU860TCZQ50D4

    No Longer Manufactured

    12NC: 935325823557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    KCU860TCZQ50D4(935325823557)
    No
    No
    N
    e0
    REACH SVHC
    2173.7

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    KCU860TCZQ50D4
    (935325823557)
    No
    3
    245
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    KCU860TCZQ50D4
    (935325823557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    KCU860TCZQ50D4
    (935325823557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label