KCU857DSLZQ50B Product Information|NXP

KCU857DSLZQ50B

No Longer Manufactured

KCU857DSLZQ50B

No Longer Manufactured

Features


PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 105C, Cu Sample

    Package


    BGA357: BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body

    Buy Options

    KCU857DSLZQ50B

    No Longer Manufactured

    12NC: 935320325557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    KCU857DSLZQ50B(935320325557)
    No
    No
    N
    e0
    REACH SVHC
    2173.7

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead SolderingLead SolderingLead Soldering
    KCU857DSLZQ50B
    (935320325557)
    No
    3
    245
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    KCU857DSLZQ50B
    (935320325557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    KCU857DSLZQ50B
    (935320325557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label