KCU850DEVR50BU Product Information|NXP

KCU850DEVR50BU

No Longer Manufactured

KCU850DEVR50BU

No Longer Manufactured

Features


PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C

    Package


    BGA256: BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body

    Buy Options

    KCU850DEVR50BU

    No Longer Manufactured

    12NC: 935318066557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    KCU850DEVR50BU(935318066557)
    Yes
    Yes
    Yes
    D
    e1
    REACH SVHC
    1662.95

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    KCU850DEVR50BU
    (935318066557)
    No
    3
    260
    40

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    KCU850DEVR50BU
    (935318066557)
    854231
    3A991A2

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    KCU850DEVR50BU
    (935318066557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label