AFD4400NXN752VB Product Information|NXP

AFD4400NXN752VB

No Longer Manufactured

AFD4400NXN752VB

No Longer Manufactured

Features


AFD4400 CoPr 553/277

    Package


    BGA1152: BGA1152, plastic, ball grid array; 1152 balls; 1 mm pitch; 35 mm x 35 mm x 2.67 mm body

    Buy Options

    AFD4400NXN752VB

    No Longer Manufactured

    12NC: 935318599557

    Details

    Order

    Operating Features

    No information available

    Environmental

    Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
    AFD4400NXN752VB(935318599557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    11222.4

    Quality

    Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
    Lead Free SolderingLead Free SolderingLead Free Soldering
    AFD4400NXN752VB
    (935318599557)
    No
    3
    250
    30

    Shipping

    Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
    AFD4400NXN752VB
    (935318599557)
    854231
    3A991A1

    Product Change Notice

    Part/12NCIssue DateEffective DatePCNTitle
    AFD4400NXN752VB
    (935318599557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    AFD4400NXN752VB
    (935318599557)
    2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments