SOT1254: DPAK Thermal Enhanced Small Outline | NXP Semiconductors

SOT1254: DPAK


Overview

plastic, thermal enhanced small outline package (DFN56 AD); 8 Leads; 1.27 mm pitch; 6 mm x 5 mm x 0.9 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
DPAK surface mount double HSO 6 x 5 x 0.9 8 plastic
Manufacture Code Reference Codes Issue Date
SOT1254 2014-11-06