MOTOROLA Issued: 13-JUN-2000 Semiconductor Products Sector Issuing Division: SESG (A) Subject: MOTOROLA PRODUCT AND PROCESS CHANGE NOTIFICATION 5628 TITLE: MOS11 CDR2 .32UM OPTIMIZED METALLIZATION EFFECTIVE DATE: 25-JUN-00 AFFECTED CHANGE CATEGORIES Wafer Process AFFECTED PRODUCT DIVISIONS IMAGING SYSTEMS DIV (LD) WIRELESS INFRASTRCT SYS DIV (NH RF/IF DIV (VW) ENTERTAINMENT SYSTEMS DIV (LB) ADDITIONAL RELIABILITY DATA: None Ref: RHJT10 SAMPLES: Contact Local Sales Contact your local Motorola Sales Office. For any questions concerning this notification: REFERENCE:MARTY ALKIS PHONE: 512-895-8921 DISCLAIMER: MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES OFFICE. ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 13-Jun-2000 NOTIFICATION #:5628 EFFECTIVE DATE: 25-Jun-2000 ISSUING DIVISION:SESG (A) DESCRIPTION AND PURPOSE ----------------------- Motorola is pleased to announce improvements to our MOS11 CDR2 0.32 um technology by implementing the metallization processes from our more advanced CDR3 technology. These process enhancements take advantage of already qualified technologies and provides increased manufacturability and process Standardization and simplification. The current CDR2 process deposits 22 kA of chemical vapor deposition (CVD) TEOS metal dielectric which is then CMP polished back down to 8 kA and capped off with 4 kA more TEOS. The CDR3 metallization deposits 23 kAof CVD TEOS and then CMP polishes down to 9 kA and uses no cap. The resulting dielectric layer shifts from 12 kA final thickness to 9 kA thickness. QUALIFICATION PLAN ------------------ Three devices were chosen from an array of product families to make up this seven wafer lot qualification. These devices are the XC56301, MPC860P, and Casper. Each of the following stresses was performed on the three different devices. Life Test (+125oC/4.5V) Of the 430 units to complete the XC level requirement of 168 hours life test stressing, only one failure was observed. This functional failure was from one of the three XC56301 K30A lots. Though the part was destroyed in failure analysis, the preliminary investigation revealed that the failure is not related to the CDR3 backend process. The remaining two lots of MPC860P K20A and Casper K05E finished 168 hours of life test stressing with no failures. One unit of the lots was removed from the qualification due to mechanical damage from handler. Test results on four of the lots at the 504 hr readpoint produced no additional failures. Life test stressing will continue to MC level readpoints of 1008 hrs. Autoclave (+121oC/15PSIG) The autoclave stress produced zero failures out of 584 units through the XC readpoint of 48 hours. Six of the seven lots finished 144 hours of stress with no failures. Two units of MCP860P were removed from qual due to mechanical damage from handler, and two additional units were removed with cracked substrates. All units were preconditioned at moisture level 3. Temperature Cycling (-65oC/+150oC) Temperature cycling produced no failures at the XC readpoint of 100 cycles. This stress was performed on 581 units, preconditioned at moisture level 3. All seven lots have continued to 500 cycles with no failures. RELIABILITY DATA SUMMARY ------------------------ This reliability data is based on process qualification using WCD 0.25um Motorola MOS-13 Redcap1 J56N for CDR3. MOS-11 qual data with this metallization change on CDR2 is based on 56301, MPC860P, and Casper. DIE DIMENSIONS: 56301: 302 x 283 mils MPC860P: 329 x 348 mils Casper: 326 x 319 mils LTDY (4.5V/125 degrees C) 168HR 504HR 1008HR 56301 Lot 1 0/80 0/80 0/80 56301 Lot 2 0/77 0/77 0/76b b. 1 unit not continued from 504 56301 Lot 3 1/76a 0/75 0/75 a. 1 func failure not CDR3-related MPC860P Lot 1 1/77c 0/76 0/76 c. 1 unit damaged in test handler Casper Lot 1 0/40 0/40 Casper Lot 2 0/40 0/40 Casper Lot 3 0/40 0/40 Autoclave (+121 degrees C / 15 PSIG) Pre 144HR 56301 Lot 1 0/80 0/80 56301 Lot 2 0/77 0/77 56301 Lot 3 0/77 0/77 MPC860P Lot 1 0/77 2/77a a. Each lot: 1 unit damaged MPC860P Lot 2 0/77 2/77a by handler, 1 unit cracked substrate MPC860P Lot 3 0/77 Casper Lot 1 0/119 0/119 Tempcycle (-65/+150 degrees C) Pre 100Cyc 500Cyc 56301 Lot 1 0/77 0/77 0/77 56301 Lot 2 0/77 0/77 0/77 56301 Lot 3 0/77 0/77 0/77 MPC860P Lot 1 0/77 0/77 0/77 MPC860P Lot 2 0/77 0/77 0/77 MPC860P Lot 3 0/77 0/77 0/77 Casper Lot 1 0/119 0/119 0/119 ELECTRICAL CHARACTERISTIC SUMMARY --------------------------------- Performance is identical. CHANGED PART IDENTIFICATION --------------------------- Mask ID changed from W52J20C to W62J20C. AFFECTED DEVICE LIST (WITHOUT SPECIALS) --------------------------------------- SPAK5307FT66B , SPAK5307FT90B , XCF5307CFT66B , XCF5307FT66B XCF5307FT90B , XCF5307FTB ======================================================================= =======================================================================