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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:01-Aug-2014
NOTIFICATION:16336
TITLE:FSL-TJN-FM LQFP CU Wire and Leadframe Flag Conversion Qual for 0.25um Auto Parts
EFFECTIVE DATE:28-Jan-2015

DEVICE(S)
MPN
S9S08LG16J0CLH
S9S08LG16J0CLHR
S9S08LG16J0VLF
S9S08LG32J0CLF
S9S08LG32J0CLH
S9S08LG32J0CLHR
S9S08LG32J0VLF
S9S08LG32J0VLFR
S9S08LG32J0VLH
S9S08MP16E2MLF
S9S08MP16E2MLFR
S9S12C128F0CPBE
S9S12C128F0CPBER
S9S12C128J2CPBE
S9S12C128J2CPBER
S9S12C32F1MFA2E
S9S12C32F1MPB1E
S9S12C32F1MPB1ER
S9S12C32F1MPB2E
S9S12C32F1MPB2ER
S9S12C32F1VFA1E
S9S12C32F1VFA1ER
S9S12C32F1VFAE2
S9S12C64F0CPBE
S9S12C64F0CPBER
S9S12C64J2CPBE
S9S12C64J2VPBE
S9S12C96J2CPBE
S9S12Q12F0VPBE1
S9S12Q12J2CPBE1
S9S12Q12J2CPBE1R
S9S12Q96J2CPBE1
S9S12Q96J2CPBE1R

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)


    • DESCRIPTION OF CHANGE

    Freescale Semiconductor announces the addition of Copper Wire as a wirebond material for 0.25um devices listed in this PCN.   These devices are assembled in Freescale Tianjin assembly site, Tianjin, China.

     
    The diameter of the wire (MP16 LQFP48 only) is changed from Au 20um to Cu 25um. Leadframe (Goldfish 48LQFP only) currently utilizing an X-Flag will convert to a Solid Flag. There is no electrical connection to the leadframe. 
     
    The part number of the mold compound will be updated per the table below. The new part number indicates a tightening of the mold compound specifications for use with Cu (Copper) wire. There are no changes in any material properties with mold compounds with tighter specifications that are still within the original specification ranges.
     
     

      ASSY SITE

    FAB

    Logic part

    Package

    mask

    WIRE

    LEADFRAME

    Mold compound

    Original

    New

    Original

    New

    Original

    New

    FSL-TJN-FM

    TSMCFAB3

    S9S08LG32

    LQFP48

    M48V

    Au 25um

    Cu 25um

    No change

     

     

     

    MC Hitachi 9200HF10M

     

     

     

    CEL-9200HF10M CW

    LQFP64

    KOI_Auto

    LQFP52

    L09S

    ATMC

    GOLDFISH_Auto

    LQFP48

    M34C

    X-Flag

    Solid-Flag

    LQFP52

    No change

    KOI_Auto

    LQFP52

    M66G

    CHD

    S9S08MP16

    LQFP48

    M84P

    Au 20um
     



    REASON FOR CHANGE

     The transfer from Gold to Copper wire is required to mitigate against raw material cost increases and for supply assurance. 
     

    The leadframe flag change enables a robust Cu wirebond process.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

     Wire composition, wire diameter (S9S08MP16 48LQFP only) and Leadframe (Goldfish 48LQFP only) are the only change to form. No Impact to fit or function. Reliability is equivalent or improved.



    According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     16-Jun-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    See attached qualification results.



    RELIABILITY DATA SUMMARY:

    See attached qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    No change to datasheet. Electrical Distribution comparison, Gold wire versus Copper wire included in this notification. Result shows no difference in Electrical Distributions.



    CHANGED PART IDENTIFICATION:

    There is no change to orderable part number. The Tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.

     The table below provides sample part numbers:

       

    LPN

    Au Part Number

    Cu Sample Part Number

    Package

    Fab

    S9S08LG32

    S9S08LG32J0VLFR

    K9S08LG32J0VLFR

    LQFP  48 7*7*1.4P0.5

    TSMCFAB3

    S9S08LG32

    S9S08LG32J0VLF

    K9S08LG32J0VLF

    LQFP  48 7*7*1.4P0.5

    TSMCFAB3

    S9S08LG32

    S9S08LG32J0CLH

    K9S08LG32J0CLH

    LQFP 64 10*10*1.4P0.5

    TSMCFAB3

    GOLDFISH_Auto

    S9S12C32F1MFA2E

    K9S12C32F1MFA2E

    LQFP  48 7*7*1.4P0.5

    ATMC

    GOLDFISH_Auto

    S9S12C32F1VFA1ER

    K9S12C32F1VFA1ER

    LQFP  48 7*7*1.4P0.5

    ATMC

    GOLDFISH_Auto

    S9S12C32F1VFA1E

    K9S12C32F1VFA1E

    LQFP  48 7*7*1.4P0.5

    ATMC

    S9S08MP16

    S9S08MP16E2MLFR

    K9S08MP16E2MLFR

    LQFP 48 7*7*1.4P0.5

    CHD

    S9S08MP16

    S9S08MP16E2MLF

    K9S08MP16E2MLF

    LQFP 48 7*7*1.4P0.5

    CHD

    KOI_Auto

    S9S12C128J2CPBER

    K9S12C128J2CPBER

    LQFP 5210*10*1.4P0.65

    TSMCFAB3

    KOI_Auto

    S9S12Q12J2CPBE1R

    K9S12Q12J2CPBE1R

    LQFP 52 10*10*1.4P0.65

    TSMCFAB3

    GOLDFISH_Auto

    S9S12C32F1MPB1ER

    K9S12C32F1MPB1ER

    LQFP 52 10*10*1.4P0.65

    ATMC

    GOLDFISH_Auto

    S9S12C32F1MPB1E

    K9S12C32F1MPB1E

    LQFP 52 10*10*1.4P0.65

    ATMC

    GOLDFISH_Auto

    S9S12C32F1MPB2ER

    K9S12C32F1MPB2ER

    LQFP 52 10*10*1.4P0.65

    ATMC
     



    SAMPLE AVAILABILITY DATE: 25-Jul-2014


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16336_TJN_LQFP_0.25um_Auto_Parts_Cu_vs_Gold_Electrical_Distribution_Report.pdf
    16336_Qual_Report_for_Auto_Cu_wire_conversion-16336.pdf