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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:28-May-2014
NOTIFICATION:16283
TITLE:MC33926PNB PQFN Cold Temperature Test Elimination
EFFECTIVE DATE:24-Nov-2014

DEVICE(S)
MPN
MC33926PNB
MC33926PNBR2

AFFECTED CHANGE CATEGORIES
  • TEST PROCESS


    • DESCRIPTION OF CHANGE

    Freescale Semiconductor announces the cold temperature test insertion elimination from the Final Test production flow of the MC33926PNB devices associated with this notification. Cold test is covered by the remaining production test flow insertions.
    This evaluation has been successfully completed according to Freescale specifications.

    Current Test Flow:
    Room Temp Probe -> Hot Temp Test ->Cold Temp Test
     
    Proposed Test Flow:
    Room Temp Probe -> Hot Temp Test
     



    REASON FOR CHANGE

    Improve capacity for optimized cycle time and delivery.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    There is no impact to device Form, Fit, Function or Reliability.



    According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     11-Apr-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    Freescale Semiconductor standard specification for Test Elimination was followed for this change. See attached Qualification Report.



    RELIABILITY DATA SUMMARY:

    NA



    ELECTRICAL CHARACTERISTIC SUMMARY:

    NA



    CHANGED PART IDENTIFICATION:

    No change to orderable part number.




    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16283_MC33926PNB_Cold_Test_Elimination_Qualification_Report_GPCN.pdf