PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

ISSUE DATE:	12-May-2014
NOTIFICATION:	16248
TITLE:	32LD/54LD SOIC Copper Wire and Stamped Leadframe Qualification
EFFECTIVE DATE:	07-Aug-2014

DEVICE(S)

MPN
MC33689DPEW
MC33689DPEWR2
MC33882PEK
MC33882PEKR2
MCZ33800EK
MCZ33800EKR2

According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change.

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For sample inquiries - please go to www.freescale.com

AFFECTED CHANGE CATEGORIES

BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

DESCRIPTION OF CHANGE

Freescale Semiconductor announces the addition of Copper (Cu) Wire as a wirebond material, along with Sumitomo EME-G630AY mold compound for the Freescale SMOS5 /SMOS8MV 32 and 54 lead SOIC package devices associated with this notification. These products are now qualified for assembly at Freescale TJN assembly site, Tianjin, China. These products were previously assembled with Gold (Au) wire and Hitachi CEL9220HF13 mold compound at Freescale TJN assembly site, Tianjin, China.

In addition, Freescale announces the qualification of a stamped leadframe for the 33800, 33882, 900504 and 900712 devices - change from etched to stamped. The leadframe materials, dimensions and vendor are identical to previous, only the form of exposed pad area changed due to new stamped process.

Samples available: KCZ33800EKR2, KCZ900712EKR2, KC33689DPEWR2, KC33882PEKR2, KC900504PEK1R2

REASON FOR CHANGE

The transfer from Gold to Copper wire, CEL9220HF13 to EME-G630AY mold compound, and etched to stamped leadframe are required to mitigate against raw material cost increases and for supply assurance.

ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

No change to fit or function, only the form of lead frame exposed pad area changed. Reliability is equivalent or improved.

QUAL DATA AVAILABILITY DATE: 03-Apr-2014

QUALIFICATION STATUS: COMPLETED

QUALIFICATION PLAN:

See attached qualification results.

RELIABILITY DATA SUMMARY:

See attached qualification results.

ELECTRICAL CHARACTERISTIC SUMMARY:

No change to datasheet. No change to Electrical Distributions.

CHANGED PART IDENTIFICATION:

There is no change to orderable part number. The tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.

SAMPLE AVAILABILITY DATE: 29-Apr-2014

ATTACHMENT(S):
External attachment(s) FOR this notification can be viewed AT:
16248_Analog_Cu_Wire_SOIC_Mold_Compound_Change_GPCN.pdf
16248_Product_A_32_54LD_SOIC_Copper_Wire_Electricial_Distribution_GPCN.pdf
16248_Product_A_32_54LD_SOIC_Copper_Wire_with_G630AY_Qualification_Results_GPCN.pdf