PRODUCT AND PROCESS CHANGE NOTIFICATION UPDATE
Generic Copy

ISSUE DATE:	09-Jul-2014
NOTIFICATION:	16235A
TITLE:	TJN QFN PACKAGE LEAD FRAME CHANGE FOLLOW COPPER WIRE CONVERSION FOR MICROCONTROLLER DEVICES
EFFECTIVE DATE:	09-Aug-2014

DEVICE(S)

MPN
MC9RS08KA1CDB
MC9RS08KA1CDBR
MC9RS08KA2CDB
MC9RS08KB12CFK
MC9RS08KB2CDC
MC9RS08KB4CFK
MC9RS08LA8CFT
MC9S08AC16CFDE
MC9S08AC16MFDE
MC9S08AC32CFDE
MC9S08AC48CFDE
MC9S08AC60CFDE
MC9S08AC60MFDE
MC9S08AC8CFDE
MC9S08AC8MFDE
MC9S08AW16CFDE
MC9S08AW16MFDE
MC9S08AW32CFDE
MC9S08AW32CFDER
MC9S08AW48CFDE
MC9S08AW60CFDE
MC9S08GT16ACFCE
MC9S08GT16ACFCER
MC9S08GT16ACFDE
MC9S08GT16ACFDER
MC9S08GT16AMFCE
MC9S08GT32ACFDE
MC9S08GT32ACFDER
MC9S08GT60ACFDE
MC9S08GT60ACFDER
MC9S08GT8ACFCE
MC9S08GT8ACFDE
MC9S08GT8AMFCE
MC9S08GT8AMFDE
MC9S08JM16CGT
MC9S08JM32CGT
MC9S08JM60CGT
MC9S08JM8CGT
MC9S08JS16CFK
MC9S08JS16LCFK
MC9S08JS8CFK
MC9S08JS8LCFK
MC9S08LL16CGT
MC9S08LL16CGTR
MC9S08LL8CGT
MC9S08QB4CGK
MC9S08QB8CGK
MC9S08QE128CFT
MC9S08QE16CFM
MC9S08QE16CFT
MC9S08QE32CFM
MC9S08QE32CFMR
MC9S08QE32CFT
MC9S08QE64CFT
MC9S08QE8CFM
MC9S08QE96CFT
MC9S08QE96CFTR
MC9S08RE16CFDE
MCF51CN128CGT
MCHC908JW16FC
MCHC908JW32FC
USB2SERA11CFK

AFFECTED CHANGE CATEGORIES

BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

DESCRIPTION OF CHANGE

Going to replace QFN package lead frame S type design by E type design in the notification list. These devices are assembled in Freescale Tianjin Final Manufacturing (TJNFM), TIANJIN, CHINA. The lead frame change also includes following changes.
1. RS908LA8 QFN 48 package flag size will change from 3.6mmx3.6mm to 5.1mmx5.1mm.
2. Datasheet will be updated accordingly to reflect outline change.

REASON FOR CHANGE

The QFN lead frame change from S type to E type is to follow industry standard to provide a more robust style which has better solderability to customer and benefit to customer's process.

ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

No Impact to form or function. Solderability is improved. Reliability is equivalent or improved.

According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

For sample inquiries - please go to www.freescale.com

RELATED NOTIFICATION(S):
16235 - Copper Wire Conversion for Microcontroller and Microprocessor Devices

TO VIEW the GENERIC copy, click on the notification number above.

QUAL DATA AVAILABILITY DATE: 15-Jul-2014

QUALIFICATION STATUS: IN PROCESS

QUALIFICATION PLAN:

Will provide per request.

RELIABILITY DATA SUMMARY:

Will provide per request.

ELECTRICAL CHARACTERISTIC SUMMARY:

No change on the operating performance of the device.

CHANGED PART IDENTIFICATION:

There is no change to orderable part number. The Tracecode marking on the device includes assembly site and datecode. Freescale will have trace ability by assembly site and datecode.

Below Cu PC parts are available for customers to order.

Other samples on PCN device list need 6 weeks’ cycle time for delivery from customer order date.

Au Part Number	Cu Part Number	Package	Fab	Assembly Site
MC9S08GT32ACFDE	PC9S8GT32ACFDE	QFN 48 EP 7SQ*1.0P0.5	TSMCFAB3	TJNFM
MCF51CN128CGT	PCF51CN128CGT	QFN 48 EP 7SQ*1.0P0.5	FSL-CHD-FAB	TJNFM

SAMPLE AVAILABILITY DATE: 02-Jun-2014

ATTACHMENT(S):
External attachment(s) FOR this notification can be viewed AT:
16235A_TJN_QFN_Cu_wire_outline_drawing_change.pdf
16235A_QFN_Cu_wire_qual-PCN16235A.pdf