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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:24-Jul-2013
NOTIFICATION:15777
TITLE:S9S08AWxx and S9S08AWxxA Copper Wire Qualification
EFFECTIVE DATE:27-Oct-2013

DEVICE(S)
MPN
S9S08AW16AE0CLC
S9S08AW16AE0CLD
S9S08AW16AE0CLDR
S9S08AW16AE0MLC
S9S08AW16AE0MLD
S9S08AW16AE0MLDR
S9S08AW16AE0VLD
S9S08AW16AE0VLDR
S9S08AW16AE1CLD
S9S08AW16AE1CLDR
S9S08AW16AE1MLD
S9S08AW16AE1MLDR
S9S08AW16E5CFGE
S9S08AW16E5CFGER
S9S08AW16E5MFGE
S9S08AW32E5CFGE
S9S08AW32E5CFGER
S9S08AW32E5CPUE
S9S08AW32E5CPUER
S9S08AW32E5MFGE
S9S08AW32E5MFGER
S9S08AW32E5MPUE
S9S08AW32E5VFGE
S9S08AW32E5VFGER
S9S08AW32E5VPUE
S9S08AW32E7CFGE
S9S08AW32E7CFGER
S9S08AW32E7CPUE
S9S08AW32E7CPUER
S9S08AW32E7MFGE
S9S08AW32E7MFGER
S9S08AW32E7MPUE
S9S08AW32E7VFGE
S9S08AW32E7VFGER
S9S08AW32E7VPUE
S9S08AW48E5CFGE
S9S08AW48E5CFGER
S9S08AW48E5CPUE
S9S08AW48E5CPUER
S9S08AW48E5MFGE
S9S08AW48E5MPUE
S9S08AW48E5MPUER
S9S08AW48E5VPUE
S9S08AW48E7CFGE
S9S08AW48E7CFGER
S9S08AW48E7CPUE
S9S08AW48E7CPUER
S9S08AW48E7MFGE
S9S08AW48E7MPUE
S9S08AW48E7MPUER
S9S08AW48E7VPUE
S9S08AW60E5CFGE
S9S08AW60E5CPUE
S9S08AW60E5CPUER
S9S08AW60E5MFGE
S9S08AW60E5MFGER
S9S08AW60E5MPUE
S9S08AW60E5MPUER
S9S08AW60E5VPUE
S9S08AW60E7VPUE
S9S08AW8AE0CLC
S9S08AW8AE0CLD
S9S08AW8AE0MLC
S9S08AW8AE0MLD
S9S08AW8AE0MLDR

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)


    • DESCRIPTION OF CHANGE

    Copper Wire is being added as a wirebond material option for the parts in the notification list currently assembled with Gold wire at Freescale TJN assembly site, Tianjin, China:

    The part number of the mold compound will be updated per the table below. The new part number indicates a tightening of the mold compound specifications for use with Cu (Copper) wire.
     

    Current Mold Compound
    MC Hitachi 9200HF10M
    Updated Mold Compound
    CEL-9200HF10M Cu Wire

     As a reminder, PCN15030 and PCN15317 were issued to communicate a mask set revision to remove erratum number SE194-STOP3DCO.

    Cu wire will be implemented on all mask set revisions.   

     



    REASON FOR CHANGE

    The transfer from Gold to Copper wire is required to mitigate against raw material cost increases and for supply assurance. 



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    Wire composition is the only change to form. No Impact to fit or function. Reliability is equivalent or improved.



    Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     05-Jul-2013

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    See attached qualification results.



    RELIABILITY DATA SUMMARY:

    See attached qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    No change to the datasheet.   Electrical Distribution comparison, Gold versus Copper wire is included in this notification.   Results show no difference in Electrical Distributions.



    CHANGED PART IDENTIFICATION:

    There is no change to orderable part number. The Tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.



    SAMPLE AVAILABILITY DATE: 29-Jul-2013


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    15777_Qual_Report_and_Electrical_Distribution_for_Auto_Cu_wire_conversion-AW60&AC16.pdf