Presented by
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Director Product Management Embedded Tools, Arm
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Development Systems Applications Engineer, NXP Semiconductors
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English
Dive into the layer concept of CMSIS, which provides a structured approach to software development. Learn how the different layers interact—including the core, driver, and middleware layers—and how they contribute to a modular and scalable software architecture. See how a sensor component uses the layer interface to port an application across multiple SoC targets. Explore the use of CMSIS in industrial applications. This session shows you how CMSIS can be utilized to develop robust and reliable industrial software, ensuring high performance and efficiency in various industrial environments. EmSA talks about how its CANOpen stack connects to CMSIS-Drivers.
This session is a part of a 7-part insightful webinar series, "The CMSIS Solution," where we delve into the benefits, development flow, and layer concept of the work done in the Open-CMSIS-Pack working group, a joint industry effort led by Arm, NXP, and others.
This series is tailored for embedded software developers and engineers looking to enhance their understanding and application of CMSIS in their projects. Many of the latest improvements will be demonstrated using Visual Studio Code.
Don't miss this opportunity to deepen your knowledge and leverage the full potential of CMSIS in your projects.
Not sure you can join? You should still register! Slides and a recording of the session will be available after the webinar.
Christopher Seidl
Director Product Management Embedded Tools, Arm
Kyle Dando
Development Systems Applications Engineer, NXP Semiconductors
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