NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC9S12DG256MPVE
Package Description:
LQFP 112 20*20*1.4P0.65
Tracking Number:
K00006D201
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
AG SPOT PLATE
RoHS CoA
CDA 194
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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