NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC9S12C32CPBE25
Package Description:
LQFP 52 10*10*1.4P0.65
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
CDA 194
RoHS CoA
AG SPOT PLATE
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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