Tessellation RLE Image Compression Technology | NXP Semiconductors

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Tessellation RLE Image Compression Technology

TESSELLATION-RLE
NXP<sup>&#174;</sup> SOFTWARE FOR TESSELLATION RUN LENGTH ENCODING (TRLE) for Image Compression

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NXP's software for Tessellation Run Length Encoding (TRLE) technology provides an efficient, lossless image compression that leverages the high performance i.MX 3D GPU while minimizing memory and bus bandwidth requirements. TRLE technology enables the highest quality graphics without overtaxing system resources.

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1-5 of 8 hardware offerings

  • i.MX 6 Android and Linux Platform
    Embedded Board Solutions

    i.MX 6 Android and Linux Platform

    It is a generic i.MX6 Android/Linux SBC supporting WiFi, BT, 4G, Camera, Ethernet, HDMI, LVDS, CAN, USB, RS232/485, -40~85℃ industrial design.
    i.MX 6 Android and Linux Platform By Shenzhen Huameishi Tech Co., Ltd. Gold Partner
  • MYC-JX8MPQ SOM
    Embedded Board Solutions

    MYC-JX8MPQ SOM

    The MYC-JX8MPQ SOM is a high performance CPU module based on NXP i.MX8M plus mpu. It is in MXM 3.0 form-factor design ,can support Linux ,and can work in both commercial ...
    MYC-JX8MPQ SOM By MYIR Electronics Limited Gold Partner
  • LILY-W1
    Module

    LILY-W1

    Wi-Fi module base on NXP Wi-Fi chip 88W8801
    LILY-W1 By u-blox AG Gold Partner
  • System on module FETMX6ULL-C
    Embedded Board Solutions

    System on module FETMX6ULL-C

    FETMX6ULL-C system on module is designed based on NXP Cortex-A7 featuring CPU i.MX6ULL processor. It runs at 800MHz, and the SoM is compact but powerful. It can support 8...
    System on module FETMX6ULL-C By Forlinx Embedded Technology Co., Ltd Gold Partner
  • SideKick-i.MX6-MXM SOM
    Embedded Board Solutions

    SideKick-i.MX6-MXM SOM

    SideKick is based on Our i.MX6 and is a MXM compatible CPU module for fast multimedia focused applications. The i.MX6 module has on-board memory expandable to 4GB DDR3 RA...
    SideKick-i.MX6-MXM SOM By Firstview Consultants Gold Partner
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