Design Files
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Differential and Gauge Pressure Sensor (-50 to 50 kPa)
The MPxx5050 family is state-of-the-art, monolithic, signal conditioned, silicon pressure sensors, featuring:
- On-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation
- Small form factor and high reliability of on-chip integration
- Advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure
Product Details
Features
Key Features
- 2.5% maximum error over 0 °C to 85 °C
- Ideally suited for microprocessor or microcontroller-based systems
- Temperature compensated from over -40 °C to +125 °C
- Silicon shear stress strain gauge
- High temperature accuracy
- Durable thermoplastic (PPS) surface mount package
- Ideal for automotive and non-automotive applications
- Easy-to-use chip carrier option
- Durable epoxy small outline package (SOP)
- Multiple porting options for design flexibility
- Barbed side ports for robust tube connection
- Easy-to-use chip carrier option
- Durable epoxy unibody element
- Easy-to-use chip carrier option
Part numbers include: MP3V5050DP, MP3V5050GC6, MP3V5050GC6U, MP3V5050GP, MP3V5050VC6U, MPVZ5050GW7U, MPX5050D, MPX5050DP, MPX5050GP, MPX5050GP1, MPXV5050DP, MPXV5050GC6, MPXV5050GC6U, MPXV5050GP, MPXV5050VC6.
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Documentation
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Design Resources
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
3 engineering services
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Independent Design House (IDH)
Hardware/Software Engineering Services
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Independent Design House (IDH)
Embedded Software Development Services
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Original Design Manufacturer (ODM)
Hardware and Software Engineering Services
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