LA12xx

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The Layerscape Access LA12xx family of programmable baseband processors delivers high-performance digital signal processing capabilities, performance scalability and application flexibility for 5G sub-6 GHz and mmWave Fixed Wireless Access equipment such as Integrated Small Cells, O-RAN Distributed Unit and Radio Unit and Customer Premises Equipment (CPE). It can be also used in proprietary wireless applications such as defense and civilian radio systems and non-terrestrial networks (NTN).

The family is equipped with a unique combination of:

High performance Vector Signal Processing Accelerators (VSPA)
Forward Error Correction Accelerator (FECA)
Integrated data converting subsystem (ADC/DAC)

For additional information and sample availability, contact NXP Support.

Data Sheet

Application Notes

Product Details

Block Diagram

Layerscape Access LA12xx Block Diagram

Get diagram PDF

Features

Core and Memory Complex

6x 32-bit e200 Power® Architecture core complex @ 614.4 MHz
Up to 8x VSPA3-16 @ 614.4 MHz (=1.3 TFLOP)
2MB On-Chip SRAM memory

Connectivity and I/O

2x PCIe Gen3 up to 8 lanes total
2x {I+Q} HS-DCS complex sampling rate of 1966.08 or 983.04 Msps

Dual channel, <1GHz RF channel bandwidth at mmWave bands

4x {I+Q} LS-DCS complex sampling up to 491.52 Msps

Four channel, <140 MHz RF channel bandwidth at sub-6 GHz bands

Acceleration

Forward Error Correction Unit (FECU)

3GPP 5G/NR 38.212 compliant gNB and UE modes
Polar decoder/encoder
LDPC decoder/encoder

Device

FC-PBGA package

Comparison Table

LA12xx Family Comparison Table

Application	Device Family	Part Number	FECA	DSP-Cores	Low-Speed DCS	High-Speed DCS
O-DU	LA120x	LA1200		N/A	N/A
O-DU	LA120x	LA1201		8x	N/A
O-RU	LA121x	LA1212	N/A	8x	2T2R	N/A
		LA1214		8x	4T4R	N/A
		LA1215		8x	N/A	mmWave
		LA1216		8x	2T2R	1*Rx Only
		LA1218		8x	4T4R	2*Rx Only
FWA-CPE	LA122x	LA1223		8x	2T2R	N/A
		LA1224		8x	Dual Use	Dual Use
		LA1325		8x	N/A	mmWave
ISC	LA123x	LA1232		8x	2T2R	N/A
		LA1234		8x	4T4R	N/A
		LA1235		8x	N/A	mmWave
		LA1236		8x	2T2R	1*Rx Only
		LA1238		8x	4T4R	2*Rx Only

Software Support

NXP provides CodeWarrior, the Integrated Development Environment associated with Layerscape Access and many other NXP devices. Included in this environment is a multi-generational, mature compiler as well as access to a rich suite of existing software / signal processing libraries, examples and training material.

A broad ecosystem and comprehensive development platform support is essential to ease development and speed time to market for a commercial grade 3GPP Stacks. All L1 and L2/+ software stack is available from NXP and/or partners depending on the device category and other requirements.

Hardware Tools

Customers can implement and develop their applications with LA12xx evaluation hardware. The LA12xx Evaluation Board is a combination of NXP LX2160 multicore Arm® processor as host and LA12xx modem as baseband for 5G-NR Fixed Wireless applications. The boards come with pre-loaded board support package (BSP) based on a standard Linux kernel.

Buy/Parametrics

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Documentation

Quick reference to our documentation types.

1-5 of 16 documents

^{Data Sheet}
LA1201_B0 Data Sheet

PDFRev 1Apr 24, 20241.2 MBLA1201_B0English
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^{Data Sheet}
LA1224_B0 Data Sheet

PDFRev 2Apr 24, 20241.3 MBLA1224_B0English
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^{Data Sheet}
LA1238_B0 Data Sheet

PDFRev 2.0Apr 24, 20241.4 MBLA1238_B0English
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^{Data Sheet}
LA1235_B0 Data Sheet

PDFRev 2.0Apr 24, 20241.3 MBLA1235_B0English
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^{Data Sheet}
LA1234_B0 Data Sheet

PDFRev 1.0Apr 24, 20241.3 MBLA1234_B0English
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^{Application Note}
Layerscape Access LA1200 and LA1201 Design Checklist

PDFRev 2Jun 10, 2024380.9 KBAN13402English
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^{Application Note}
Layerscape Access LA1238 Design Checklist

PDFRev 4Jun 10, 2024442.0 KBAN13410English
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^{Application Note}
Layerscape Access LA1234 Design Checklist

PDFRev 2Jun 10, 2024425.3 KBAN13411English
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^{Application Note}
Layerscape Access LA1224 Design Checklist

PDFRev 2Jun 10, 2024531.6 KBAN13357English
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^{Application Note}
Layerscape Access LA1215, LA1325, and, LA1235 Design Checklist

PDFRev 2Jun 10, 2024504.3 KBAN13401English
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^{Application Note}
General soldering Temperature Process Guidelines

PDFRev 1Aug 16, 2017281.6 KBAN3300English
^{Application Note}
Solder Joint Temperature and Package Peak Temperature

PDFRev 0Aug 2, 2006151.6 KBAN3298English
^{User Guide}
How to Update Software Images on LA1224-RDB

HTML | PDFRev 1.0Jul 31, 2024208.8 KBUG10135English
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^{Fact Sheet}
Non-Terrestrial Networking: Extending the Internet to Space

PDFRev 0Aug 5, 2024279.3 KBNTN-FSEnglish
^{Fact Sheet}
LA12xx Family of Programmable Baseband Processors Fact Sheet

PDFRev 0Aug 22, 20231.6 MBLA12XXA4A4English
^{White Paper}
Digital Airfast Reference Design - White Paper

PDFRev 0May 30, 2024710.1 KBDIGAIRFASTWPEnglish
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