32-Bit Arm® Cortex®-M4 + 2 X M0 MCU; 282 KB SRAM; Ethernet; Two HS USBs; 80 Msps 12-Bit ADC; Configurable Peripherals, AES Engine

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Product Details

Features

  • Main Cortex-M4 processor
    • Arm Cortex-M4 processor, running at frequencies of up to 204 MHz.
    • Built-in Memory Protection Unit (MPU) supporting eight regions.
    • Built-in Nested Vectored Interrupt Controller (NVIC).
    • Hardware floating-point unit.
    • Non-maskable Interrupt (NMI) input.
    • JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch points.
    • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
    • System tick timer.
  • Cortex-M0 coprocessor
    • Arm Cortex-M0 coprocessor capable of off-loading the main Arm Cortex-M4 processor.
    • Running at frequencies of up to 204 MHz.
    • JTAG and built-in NVIC.
  • Cortex-M0 subsystem
    • Arm Cortex-M0 processor controlling the SPI and SGPIO peripherals residing on a separate AHB multilayer matrix with direct access to 2 kB + 16 kB of SRAM.
    • Running at frequencies of up to 204 MHz.
    • Connected via a core-to-core bridge to the main AHB multilayer matrix and the main Arm Cortex-M4 processor.
    • JTAG and built-in NVIC.
  • On-chip memory
    • 264 kB SRAM for code and data use on the main AHB multilayer matrix plus 18 kB of SRAM on the Cortex-M0 subsystem.
    • Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually.
    • 64 kB ROM containing boot code and on-chip software drivers.
    • 64-bit of One-Time Programmable (OTP) memory for general-purpose use.
    • Two banks (256 bit total) One-Time Programmable (OTP) memory for AES key storage. One bank can store an encrypted key for decoding the boot image.
  • AES engine for encryption and decryption of the boot image and data with DMA support and programmable via a ROM-based API.
  • Configurable digital peripherals
    • Serial GPIO (SGPIO) interface.
    • State Configurable Timer (SCT) subsystem on AHB.
    • Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and outputs to event driven peripherals like the timers, SCT, and ADC0/1.
  • Serial interfaces
    • Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second.
    • 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2).
    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support and on-chip high-speed PHY.
    • One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to external high-speed PHY.
    • USB interface electrical test software included in ROM USB stack.
    • One 550 UART with DMA support and full modem interface.
    • Three 550 USARTs with DMA and synchronous mode support and a smart card interface conforming to ISO7816 specification. One USART with IrDA interface.
    • Two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller excludes operation of all other peripherals connected to the same bus bridge.
    • Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA support.
    • One SPI controller.
    • One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/O pins conforming to the full I²C-bus specification. Supports data rates of up to 1 Mbit/s.
    • One standard I²C-bus interface with monitor mode and with standard I/O pins.
    • Two I²S interfaces, each with DMA support and with one input and one output.
  • Digital peripherals
    • External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash, and SDRAM devices.
    • LCD controller with DMA support and a programmable display resolution of up to 1024 H x 768 V. Supports monochrome and color STN panels and TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel mapping.
    • Secure Digital Input Output (SD/MMC) card interface.
    • Eight-channel General-Purpose DMA (GPDMA) controller can access all memories on the AHB and all DMA-capable AHB followers
    • 164 General-Purpose Input/Output (GPIO) pins with configurable pull-up/pull-down resistors and open-drain mode.
    • GPIO registers are located on the AHB for fast access. GPIO ports have DMA support.
    • Up to eight GPIO pins can be selected from all GPIO pins as edge and level sensitive interrupt sources.
    • Two GPIO group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins.
    • Four general-purpose timer/counters with capture and match capabilities.
    • One motor control Pulse Width Modulator (PWM) for three-phase motor control.
    • One Quadrature Encoder Interface (QEI).
    • Repetitive Interrupt timer (RI timer).
    • Windowed watchdog timer (WWDT).
    • Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes of battery powered backup registers.
    • Alarm timer; can be battery powered.
  • Analog peripherals
    • One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s. LBGA256 package only.
    • Two 8-channel, 10-bit ADCs (ADC0/1) with DMA support and a data conversion rate of 400 kSamples/s for a total of 16 independent channels. The 10-bit ADCs are only available on the LBGA256 package.
    • One 6-channel, 12-bit high-speed ADC (ADCHS) with DMA support and a data conversion rate of 80 MSamples/s.
  • Unique ID for each device.
  • Clock generation unit
    • Crystal oscillator with an operating range of 1 MHz to 25 MHz.
    • 12 MHz Internal RC (IRC) oscillator trimmed to 1 % accuracy over temperature and voltage.
    • Ultra-low power Real-Time Clock (RTC) crystal oscillator.
    • Three PLLs allow CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the third PLL can be used as audio PLL.
    • Clock output.
  • Power
    • Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip DC-to-DC converter for the core supply and the RTC power domain.
    • RTC power domain can be powered separately by a 3 V battery supply.
    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.
    • Processor wake-up from Sleep mode via wake-up interrupts from various peripherals.
    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the RTC power domain.
    • Brownout detect with four separate thresholds for interrupt and forced reset.
    • Power-On Reset (POR).
    • Available as LBGA256 package.

Target Applications

  • Secure industrial gateways
  • Automotive aftermarket, including telematics
  • Smart meters
  • Industrial controls
  • Industrial automation
  • Diagnostic equipment
  • White goods HMI
  • Data collectors and navigation
  • Electronic instruments

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