LIN Physical Interface | NXP Semiconductors

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The NXP MC33399 is a physical layer component dedicated to automotive sub-bus applications.

Offers communication speed from 1.0kbps to 20kbps, and up to 60kbps for programming mode
Provides digital communications over multiple-node low to medium speed network
Waveshaping reduces EMI problems
Two operating modes: Normal and Sleep
Supports LIN protocol specification 1.3

Application Notes

Documentation

Quick reference to our documentation types.

1-5 of 6 documents

^{Data Sheet}
MC33399, Local Interconnect Network (LIN) Physical Interface - Data Sheet

PDFRev 10.0Apr 11, 2013616.8 KBMC33399English
^{Application Note}
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note

PDFRev 3.0Oct 21, 20143.5 MBAN2409English
^{Application Note}
AN3670, Implementing a DSI Network Using the MC33781 and the MC33784

PDFRev 1.0Oct 29, 20081.0 MBAN3670English
^{Application Note}
Car Door Keypad Using LIN

PDFRev 2Jan 4, 2007265.7 KBAN2205English
^{Application Note}
AN2396, Servo Motor Control Application on a Local Area Interconnect Network (LIN)

PDFRev 1Dec 15, 20051.0 MBAN2396English
^{Application Note Software}
AN2396SW, Software files for AN2396

ZIPRev 0Apr 18, 2003584.2 KBAN2396SWEnglish
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Design Resources

Design Files

Receive the full breakdown. See the product footprint and more in the eCad file.

Training

1 trainings

^On-Demand
Automotive Ethernet—Enabler of Future Connected Cars

41 minEnglish Level: Beginner
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