Design Files
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LIN 2.1 / SAEJ2602-2, LIN Physical Layer
The NXP® MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.
- Designed to support automotive networks with Controller Area Network (CAN)
- Part number selection defines the operating baud rate (33662L or 33662S for 20 kB/s and 33662J for 10 kB/s)
- Both integrate a fast baud rate (100 kB/s) for test and programming modes
- Provides excellent Electromagnetic Compatibility (EMC) and Radiated Emission performance, Electrostatic Discharge (ESD) robustness and safe behaviour in case of TXD short to ground
MC33662_IMG
Product Details
Features
Key Features
- Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC, and handles 40 V during Load Dump
- Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and SAEJ2602-2
- Active bus wave shaping, offering excellent radiated emission performance
- Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, 20 kV on the WAKE pin, and 25 kV on the VSUP pin
- Very high immunity against electromagnetic interference
- Low standby current in Sleep mode
- Over-temperature protection
- Local and remote Wake-up capability reported by the RXD pin
- Fast baud rate selection reported by RXD pin
- 5.0 V and 3.3 V compatible digital inputs without any required external components
Product Longevity Program
- This product is included in the NXP Product Longevity Program ensuring a stable supply of products for your embedded designs. The MC33662 is included in the 15-year program
Buy/Parametrics
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Documentation
Quick reference to our documentation types.
4 documents
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Application Note
AN2409, Small Outline Integrated Circuit (SOIC) Package - Application NoteFeatured
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Data Sheet
MC33662, LIN 2.1 / SAEJ2602-2, LIN Physical Layer - Data SheetFeatured
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Application Note
AN3670, Implementing a DSI Network Using the MC33781 and the MC33784
Design Resources
Hardware
Quick reference to our
board types.
1-5 of 6 hardware offerings
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Evaluation and Development BoardsMC33662L LIN2.1/SAEJ2602-2, LIN Phy Evaluation KitFeatured
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Evaluation and Development Boards
MC33662J LIN Physical Layer Evaluation KitFeatured
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Complete SolutionMPC5775B BMS and VCU Reference Design
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Evaluation and Development BoardsS32V2 Vision and Sensor Fusion Evaluation System
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Evaluation and Development BoardsMPC574xB/C/G Body, Gateway, and Networking Evaluation System
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
2 engineering services
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Independent Design House (IDH)
Hardware/Software Engineering Services
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Independent Design House (IDH)
Hardware/Software Engineering Services
To find additional partner offerings that support this product, visit our Partner Marketplace.