Surface Mount to DIP Evaluation Board

OM13493 Archived
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

Roll over image to zoom in

OM13493 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13493 supports the following packages: DHVQFN24 (SOT616-1), DHVQFN20 (SOT662-1), DHVQFN16 (SOT763-1) and DHVQFN14 (SOT762-1).

Product Details

Features

Connectivity

  • Expand the kit with add-on I2C daughter cards
  • Easy connection to small surface mount packages

Key Features

  • Allows evaluation of device that is only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards

Documentation

Quick reference to our documentation types.

Filters

1 documents

Support

What do you need help with?

Search