NTB0104 | NXP Semiconductors

Automotive

Industrial

Consumer

Technologies

Dual-Supply Translating Transceiver (Auto-Direction Sensing, Three-State)

NTB0104
Active

The NTB0104 is a 4-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.2 V and 3.6 V and VCC(B) can be supplied at any voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V).

Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Block Diagram

NTB0104

NTB0104 Block Diagram
Get diagram PDF

Features

Microcontrollers (MCUs)

  • Wide supply voltage range:
    • VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
  • IOFF circuitry provides partial Power-down mode operation
  • Inputs accept voltages up to 5.5 V
  • ESD protection:
    • HBM JESD22-A114E Class 2 exceeds 2500 V for A port
    • HBM JESD22-A114E Class 3B exceeds 15000 V for B port
    • MM JESD22-A115-A exceeds 200 V
    • CDM JESD22-C101E exceeds 1500 V (For NTB0104UK 1000 V)
  • Latch-up performance exceeds 100 mA per JESD 78B Class II
  • Multiple package options
  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Buy/Parametrics

4 results

Include 1 NRND

Part

Show description

Order

CAD Model

Status

Signal Application

Type VLT

Number of bits

VCC(A) (Min - Max)

VCC(B) (Min-Max)

Supply Current (Typ) (μA)

Bandwidth (Max) (MHz)

Input Type (TTL, CMOS, Schmitt Trigger)

Output Type (Open Drain, 3-State, Push-Pull, Pass-gate)

Ambient Operating Temperature (Min to Max) (℃)

AEC-Q100 compliant

Package Type

Package Dimensions (LxWxZ (mm))

Budgetary Price excluding tax

NTB0104BQ
Data Sheet

Active

Push-pull signals, SPI

BiDirectional Buffer w/one shot

4

1.2 to 3.6

1.65 to 5.5

3.5

100

CMOS

3-State, Push-Pull

-40 to 125

N

DHVQFN14

2.5 x 3 x 0.85

1K @ US$0.30
NTB0104BQ-Q100
Data Sheet

Active

Push-pull signals, SPI

BiDirectional Buffer w/one shot

4

1.2 to 3.6

1.65 to 5.5

3.5

100

CMOS

3-State, Push-Pull

-40 to 125

Y

DHVQFN14

2.5 x 3 x 0.85

1K @ US$0.35
NTB0104GU12
Data Sheet

Active

Push-pull signals, SPI

BiDirectional Buffer w/one shot

4

1.2 to 3.6

1.65 to 5.5

3.5

100

CMOS

3-State, Push-Pull

-40 to 125

N

XQFN12

1.7 x 2 x 0.5

1K @ US$0.33
NTB0104UK-Q100
Data Sheet
—

Active

Push-pull signals, SPI

BiDirectional Buffer w/one shot

4

1.65 to 3.6

2.3 to 5.5

3.5

100

CMOS

3-State, Push-Pull

-40 to 125

Y

DHVQFN14

2.5 x 3 x 0.85

1K @ US$0.49
N true 0 PSPNTB0104en 10 Application Note Application Note t789 2 Data Sheet Data Sheet t520 2 Package Information Package Information t790 3 Packing Information Packing Information t935 2 Selector Guide Selector Guide t528 1 en_US en_US en Data Sheet Data Sheet 2 1 4.1 English 1442062920583699533009 PSP 437.2 KB None None documents None 1442062920583699533009 /docs/en/data-sheet/NTB0104.pdf 437246 /docs/en/data-sheet/NTB0104.pdf NTB0104 documents N N 2016-10-08 Dual supply translating transceiver; auto direction sensing; 3-state /docs/en/data-sheet/NTB0104.pdf /docs/en/data-sheet/NTB0104.pdf Data Sheet N 980000996212993340 2024-10-18 pdf N en Oct 17, 2024 980000996212993340 Data Sheet Y N Dual supply translating transceiver; auto direction sensing; 3-state PDF 2 2.0 English 1442054238013695909884 PSP 250.9 KB None None documents None 1442054238013695909884 /docs/en/data-sheet/NTB0104_Q100.pdf 250876 /docs/en/data-sheet/NTB0104_Q100.pdf NTB0104_Q100 documents N N 2016-10-08 Dual supply translating transceiver; auto direction sensing; 3-state /docs/en/data-sheet/NTB0104_Q100.pdf /docs/en/data-sheet/NTB0104_Q100.pdf Data Sheet N 980000996212993340 2024-03-12 pdf N en Feb 16, 2017 980000996212993340 Data Sheet Y N Dual supply translating transceiver; auto direction sensing; 3-state PDF Application Note Application Note 2 3 9.0 English This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. 1442088844452695860837 PSP 3.5 MB Registration without Disclaimer None documents Extended 1442088844452695860837 /secured/assets/documents/en/application-note/AN10439.pdf 3465258 /secured/assets/documents/en/application-note/AN10439.pdf AN10439 documents Y N 2016-10-08 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /webapp/Download?colCode=AN10439 /secured/assets/documents/en/application-note/AN10439.pdf Application Note N 645036621402383989 2024-04-23 pdf Y en Jan 27, 2022 645036621402383989 Application Note Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note PDF 4 8.0 English This application note provides guidelines for the board mounting and handling of NXP semiconductor packages. 1442088340466730481306 PSP 1.4 MB None None documents None 1442088340466730481306 /docs/en/application-note/AN10365.pdf 1359519 /docs/en/application-note/AN10365.pdf AN10365 documents N N 2016-10-08 AN10365, Surface mount reflow soldering - Application note /docs/en/application-note/AN10365.pdf /docs/en/application-note/AN10365.pdf Application Note N 645036621402383989 2024-07-15 pdf N en Oct 1, 2021 645036621402383989 Application Note Y N AN10365, Surface mount reflow soldering - Application note PDF Package Information Package Information 3 5 1.0 English 1455078823631719049861 PSP 261.9 KB None None documents None 1455078823631719049861 /docs/en/package-information/SOT1174-1.pdf 261910 /docs/en/package-information/SOT1174-1.pdf SOT1174-1 documents N N 2016-02-12 plastic, extremely thin quad flat package; no leads 12 terminals /docs/en/package-information/SOT1174-1.pdf /docs/en/package-information/SOT1174-1.pdf Package Information N 302435339416912908 2024-03-12 pdf N en Feb 8, 2016 302435339416912908 Package Information Y N plastic, extremely thin quad flat package; no leads 12 terminals 6 1.0 English 1455079019638715630011 PSP 167.9 KB None None documents None 1455079019638715630011 /docs/en/package-information/OL-NTB0104UK.pdf 167901 /docs/en/package-information/OL-NTB0104UK.pdf OL-NTB0104UK documents N N 2016-02-12 wafer level chip-size package, 12 bumps /docs/en/package-information/OL-NTB0104UK.pdf /docs/en/package-information/OL-NTB0104UK.pdf Package Information N 302435339416912908 2024-03-12 pdf N en Feb 8, 2016 302435339416912908 Package Information Y N wafer level chip-size package, 12 bumps 7 1.0 English 1455079114751729486392 PSP 127.1 KB None None documents None 1455079114751729486392 /docs/en/package-information/SOT762-1.pdf 127098 /docs/en/package-information/SOT762-1.pdf SOT762-1 documents N N 2016-10-08 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm /docs/en/package-information/SOT762-1.pdf /docs/en/package-information/SOT762-1.pdf Package Information N 302435339416912908 2024-03-13 pdf N en Feb 8, 2016 302435339416912908 Package Information Y N plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm Packing Information Packing Information 2 8 3.0 English 1442131586016718597435 PSP 111.1 KB None None documents None 1442131586016718597435 /docs/en/packing/SOT762-1_115.pdf 111067 /docs/en/packing/SOT762-1_115.pdf SOT762-1_115 documents N N 2016-10-08 Standard product orientation 12NC ending 115 /docs/en/packing/SOT762-1_115.pdf /docs/en/packing/SOT762-1_115.pdf Packing Information N 145666923842250347 2023-10-17 pdf N en Apr 9, 2013 145666923842250347 Packing Information Y N Standard product orientation 12NC ending 115 9 2.0 English 1442131569303729582546 PSP 89.2 KB None None documents None 1442131569303729582546 /docs/en/packing/SOT1174-1_115.pdf 89197 /docs/en/packing/SOT1174-1_115.pdf SOT1174-1_115 documents N N 2013-04-17 Standard product orientation 12NC ending 115 /docs/en/packing/SOT1174-1_115.pdf /docs/en/packing/SOT1174-1_115.pdf Packing Information N 145666923842250347 2023-10-17 pdf N en Apr 4, 2013 145666923842250347 Packing Information Y N Standard product orientation 12NC ending 115 Selector Guide Selector Guide 1 10 2.1 English 1442126252734722248255 PSP 3.3 MB None None documents None 1442126252734722248255 /docs/en/product-selector-guide/75017085.pdf 3301382 /docs/en/product-selector-guide/75017085.pdf 75017085 documents N N 2016-10-08 Application guide: Flat-panel TV sets /docs/en/product-selector-guide/75017085.pdf /docs/en/product-selector-guide/75017085.pdf Selector Guide N 553557935274807777 2025-02-11 pdf N en Mar 12, 2012 553557935274807777 Selector Guide Y N Application guide: Flat-panel TV sets false 0 NTB0104 downloads en true 1 Y PSP Y Y Application Note 2 /secured/assets/documents/en/application-note/AN10439.pdf 2016-10-08 1442088844452695860837 PSP 3 Jan 27, 2022 Application Note This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. PDF Registration without Disclaimer /secured/assets/documents/en/application-note/AN10439.pdf English documents 3465258 None 645036621402383989 2024-04-23 Y /webapp/Download?colCode=AN10439 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /secured/assets/documents/en/application-note/AN10439.pdf documents 645036621402383989 Application Note N en Extended Y pdf 9.0 Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note 3.5 MB AN10439 N 1442088844452695860837 /docs/en/application-note/AN10365.pdf 2016-10-08 1442088340466730481306 PSP 4 Oct 1, 2021 Application Note This application note provides guidelines for the board mounting and handling of NXP semiconductor packages. PDF None /docs/en/application-note/AN10365.pdf English documents 1359519 None 645036621402383989 2024-07-15 N /docs/en/application-note/AN10365.pdf AN10365, Surface mount reflow soldering - Application note /docs/en/application-note/AN10365.pdf documents 645036621402383989 Application Note N en None Y pdf 8.0 N N AN10365, Surface mount reflow soldering - Application note 1.4 MB AN10365 N 1442088340466730481306 Data Sheet 2 /docs/en/data-sheet/NTB0104.pdf 2016-10-08 1442062920583699533009 PSP 1 Oct 17, 2024 Data Sheet PDF None /docs/en/data-sheet/NTB0104.pdf English documents 437246 None 980000996212993340 2024-10-18 N /docs/en/data-sheet/NTB0104.pdf Dual supply translating transceiver; auto direction sensing; 3-state /docs/en/data-sheet/NTB0104.pdf documents 980000996212993340 Data Sheet N en None Y pdf 4.1 N N Dual supply translating transceiver; auto direction sensing; 3-state 437.2 KB NTB0104 N 1442062920583699533009 /docs/en/data-sheet/NTB0104_Q100.pdf 2016-10-08 1442054238013695909884 PSP 2 Feb 16, 2017 Data Sheet PDF None /docs/en/data-sheet/NTB0104_Q100.pdf English documents 250876 None 980000996212993340 2024-03-12 N /docs/en/data-sheet/NTB0104_Q100.pdf Dual supply translating transceiver; auto direction sensing; 3-state /docs/en/data-sheet/NTB0104_Q100.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.0 N N Dual supply translating transceiver; auto direction sensing; 3-state 250.9 KB NTB0104_Q100 N 1442054238013695909884 Package Information 3 /docs/en/package-information/SOT1174-1.pdf 2016-02-12 1455078823631719049861 PSP 5 Feb 8, 2016 Package Information None /docs/en/package-information/SOT1174-1.pdf English documents 261910 None 302435339416912908 2024-03-12 N /docs/en/package-information/SOT1174-1.pdf plastic, extremely thin quad flat package; no leads 12 terminals /docs/en/package-information/SOT1174-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic, extremely thin quad flat package; no leads 12 terminals 261.9 KB SOT1174-1 N 1455078823631719049861 /docs/en/package-information/OL-NTB0104UK.pdf 2016-02-12 1455079019638715630011 PSP 6 Feb 8, 2016 Package Information None /docs/en/package-information/OL-NTB0104UK.pdf English documents 167901 None 302435339416912908 2024-03-12 N /docs/en/package-information/OL-NTB0104UK.pdf wafer level chip-size package, 12 bumps /docs/en/package-information/OL-NTB0104UK.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N wafer level chip-size package, 12 bumps 167.9 KB OL-NTB0104UK N 1455079019638715630011 /docs/en/package-information/SOT762-1.pdf 2016-10-08 1455079114751729486392 PSP 7 Feb 8, 2016 Package Information None /docs/en/package-information/SOT762-1.pdf English documents 127098 None 302435339416912908 2024-03-13 N /docs/en/package-information/SOT762-1.pdf plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm /docs/en/package-information/SOT762-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm 127.1 KB SOT762-1 N 1455079114751729486392 Packing Information 2 /docs/en/packing/SOT762-1_115.pdf 2016-10-08 1442131586016718597435 PSP 8 Apr 9, 2013 Packing Information None /docs/en/packing/SOT762-1_115.pdf English documents 111067 None 145666923842250347 2023-10-17 N /docs/en/packing/SOT762-1_115.pdf Standard product orientation 12NC ending 115 /docs/en/packing/SOT762-1_115.pdf documents 145666923842250347 Packing Information N en None Y pdf 3.0 N N Standard product orientation 12NC ending 115 111.1 KB SOT762-1_115 N 1442131586016718597435 /docs/en/packing/SOT1174-1_115.pdf 2013-04-17 1442131569303729582546 PSP 9 Apr 4, 2013 Packing Information None /docs/en/packing/SOT1174-1_115.pdf English documents 89197 None 145666923842250347 2023-10-17 N /docs/en/packing/SOT1174-1_115.pdf Standard product orientation 12NC ending 115 /docs/en/packing/SOT1174-1_115.pdf documents 145666923842250347 Packing Information N en None Y pdf 2.0 N N Standard product orientation 12NC ending 115 89.2 KB SOT1174-1_115 N 1442131569303729582546 Selector Guide 1 /docs/en/product-selector-guide/75017085.pdf 2016-10-08 1442126252734722248255 PSP 10 Mar 12, 2012 Selector Guide None /docs/en/product-selector-guide/75017085.pdf English documents 3301382 None 553557935274807777 2025-02-11 N /docs/en/product-selector-guide/75017085.pdf Application guide: Flat-panel TV sets /docs/en/product-selector-guide/75017085.pdf documents 553557935274807777 Selector Guide N en None Y pdf 2.1 N N Application guide: Flat-panel TV sets 3.3 MB 75017085 N 1442126252734722248255 true Y Products

Documentation

Quick reference to our documentation types.

Filters

10 documents

Compact List

Application Note (2)
Data Sheet (2)
Package Information (3)
Packing Information (2)
Selector Guide (1)

Design Files

Quick reference to our design files types.
Filters

1-5of 6 design files

Show All

Hardware

Quick reference to our board types.
Filters

3 hardware offerings

Engineering Services

2 engineering services

To find additional partner offerings that support this product, visit our Partner Marketplace.

Support

What do you need help with?

Search