SAF3561 | Terrestrial Digital Radio Processor | NXP Semiconductors

Terrestrial Digital Radio Processor

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Product Details

Features

DAB, DAB+ and T-DMB Radio Technology

  • DAB, DAB+ and T-DMB baseband signal decoding and processing
  • Data services and background scanning DAB, DAB+ and T-DMB support for second ensemble
  • Front end to baseband interface support through both serial BB_I2S interface and/or parallel baseband bus type interface
  • Secondary baseband interface for dual tuner applications either with serial BB_I2S interface or parallel baseband bus type interface
  • Contact NXP Semiconductors for details on supported DAB, DAB+, T-DMB capabilities of SAF3561:
    • Metadata support for digital radio
    • Data services support for digital radio
    • Program services support for digital radio
    • Seamless blending with an FM or second DAB audio service
    • Advanced audio error concealment features
    • Impulse noise and spur cancelation
  • Support for multiple RF tuner frontends (Contact NXP Semiconductors for a list of supported RF tuner frontends)

Digital Audio

  • Up to 6 channel (5.1) audio support through I²S-bus serial audio interface
  • Optional SRC (8 kHz to 48 kHz) for up to 6 channels of I²S-bus audio output
  • I²S-bus serial audio input for auxiliary processing
  • Optional SRC (8 kHz to 48 kHz) for I²S-bus input
  • Optional restricted support for 96 kHz input and output sample-rate conversion
  • Optional digital audio output through S/PDIF (without SRC)
  • Basic audio processing for external digital audio sources
  • Advanced audio processing (Contact NXP Semiconductors for a list of supported audio processing features)

Memory

  • Supports SDR-SDRAM controller (up to 512 Mbit in 16-bit configuration)
  • Supports serial NOR-Flash memory with various sizes depending on the actual application

Other Peripheral Interfaces

  • Two I²C-bus interfaces
  • Three Serial Peripheral Interfaces (SPI)
  • One UART interface with flow control or two UART interfaces w/o flow control
  • Five individual GPIO pins for applications and diagnostics
  • One JTAG interface for diagnostics

Miscellaneous

  • One internal clock oscillator and two internal Phase-Locked Loops (PLL)
  • Can run on external crystal or reference clock from external IC
  • Powerful signal and audio processing core architecture
  • Qualified in accordance with AEC-Q100

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Package Type

HLQFP144

LFBGA170

N true 0 PSPSAF3561en 2 Package Information Package Information t790 2 en_US en_US en Package Information Package Information 2 1 1.2 English 1455079554072723085249 PSP 607.2 KB None None documents None 1455079554072723085249 /docs/en/package-information/SOT1315-1.pdf 607233 /docs/en/package-information/SOT1315-1.pdf SOT1315-1 documents N N 2016-06-08 plastic low profile fine-pitch ball grid array package; 170 balls /docs/en/package-information/SOT1315-1.pdf /docs/en/package-information/SOT1315-1.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jun 8, 2016 302435339416912908 Package Information Y N plastic low profile fine-pitch ball grid array package; 170 balls 2 1.0 English 1455079603683716137560 PSP 864.0 KB None None documents None 1455079603683716137560 /docs/en/package-information/SOT612-4.pdf 863980 /docs/en/package-information/SOT612-4.pdf SOT612-4 documents N N 2016-02-12 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-4.pdf /docs/en/package-information/SOT612-4.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jun 8, 2016 302435339416912908 Package Information Y N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad false 0 SAF3561 downloads en true 1 Y PSP Package Information 2 /docs/en/package-information/SOT1315-1.pdf 2016-06-08 1455079554072723085249 PSP 1 Jun 8, 2016 Package Information None /docs/en/package-information/SOT1315-1.pdf English documents 607233 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT1315-1.pdf plastic low profile fine-pitch ball grid array package; 170 balls /docs/en/package-information/SOT1315-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.2 N N plastic low profile fine-pitch ball grid array package; 170 balls 607.2 KB SOT1315-1 N 1455079554072723085249 /docs/en/package-information/SOT612-4.pdf 2016-02-12 1455079603683716137560 PSP 2 Jun 8, 2016 Package Information None /docs/en/package-information/SOT612-4.pdf English documents 863980 None 302435339416912908 2022-12-07 N /docs/en/package-information/SOT612-4.pdf plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad /docs/en/package-information/SOT612-4.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N N plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 864.0 KB SOT612-4 N 1455079603683716137560 true Y Products

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