WLCSP25_5X5: WLCSP

Overview

wafer level chip-size package; 25 bumps (5 x 5)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
WLCSP25_5X5	WLCSP	surface mount	bottom	UC		25	other

Manufacture Code	Reference Codes	Issue Date
WLCSP25		2010-02-11