2.4/5 GHz Dual-Band 1x1 Wi-Fi® 6 + Bluetooth Low Energy 5.4 + 802.15.4 Tri-Radio Solution
Compact List
i.MX 93W Integrated Wireless Applications Processor: Dual Arm® Cortex®-A55, AI/ML Accelerator, Wi‑Fi 6 + BLE + 802.15.4 Tri-Radio
- This page contains information on a preproduction product. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.
The i.MX 93W brings compute and connectivity together by integrating the i.MX 93 applications processor, the IW610G tri‑radio and the complete IW610G radio bill of materials (BOM)—covering - covering passives, crystal and radio frequency (RF) front-end—into a single package. Featuring Arm® Cortex®-A55 and Cortex‑M33 cores, an EdgeLock® Secure Enclave, dedicated neural processor (NPU), dual‑band Wi‑Fi 6, Bluetooth® Low Energy (LE) and 802.15.4.
This integration simplifies RF design, speeds certification and time‑to‑market. It also reduces size and supply‑chain complexity by replacing up to 60 discrete components with a single, pre‑validated solution.
The i.MX 93W processor will be available in Q2 2027.
Product Details
Block Diagram
Choose a diagram:
Features
Multicore Processing
- 1-2x Arm Cortex-A55 @ 1.7 GHz
- Arm Cortex-M33 @ 250Mhz
- Arm® Ethos™ U-65 microNPU
- EdgeLock secure enclave
Connectivity
- 2x USB 2.0 Type C with PHY
- 2x Gb Ethernet: audio/video bridging (AVB) and IEEE 1588 for sync, and energy-efficient Ethernet for low power. 1 with time‑sensitive networking (TSN)
- 1x controller area network flexible data‑rate (CAN FD)
- 7x universal asynchronous receiver‑transmitter (UART), 8x inter‑integrated circuit (I²C), 7x serial peripheral interface (SPI), 2x improved inter‑integrated circuit (I3C)
- 1x 4-ch, 12-bit analog‑to‑digital converter (ADC)
- 2x 32-pin FlexIO interfaces (camera, bus or serial I/O)
External Memory
- Up to 3.7GT/s x16 low‑power double data rate (LPDDR) 4/LPDDR4X —with inline error correction code (ECC)
- 2x SD 3.0/ SDIO3.0/ embedded multimedia card (eMMC)5.1
Graphics
- Hardware Hardware compositor for blending/composition, resize, color space conversion
Display Interfaces
- 1x 1080p60 mobile industry processor interface display serial interface (MIPI‑DSI) (4-lane, 1.5Gbps/lane) with PHY
- 1x 720p60 low‑voltage differential signaling (LVDS) (4-lane)
- 24-bit parallel RGB
Camera Interfaces
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1x 1080p60 mobile industry processor interface camera serial interface (MIPI‑CSI) (2-lane, 1.5Gbps/lane) with physical layer (PHY) 8-bit parallel YUV/RGB
Audio
- 7x I2S time‑division multiplexing (TDM) (32-bit @ 768KHz), Sony/Phillips digital interface (SPDIF) transmit / receive (Tx / Rx)
- 8 channel pulse density modulation (PDM) microphone input
- Medium quality sound (MQS): Medium Quality Sound output (sigma-delta modulator)
Wi-Fi Connectivity
- 1x1 dual band 2.4 GHz / 5 GHz 802.11 a/b/g/n/ax
- 256 quadrature amplitude modulation (QAM), 20 MHz bandwidth, peak throughput: 114.7 Mbps
- Wi-Fi Tx output power up to +21 dBm
- Wi-Fi 6 Extended Range (ER), Dual Carrier Modulation (DCM), Target Wait Time (TWT)
- Low-power Wi-Fi idle, standby and sleep modes
- wi‑fi protected access (WPA) 2 / WPA3 Enterprise security
- Support for Matter over Wi-Fi
- Single, dual antenna with diversity
Bluetooth LE Connectivity
- Switchable Bluetooth LE/802.15.4 operation
- Integrated power amplifier (PA) / (LNA) low noise amplifier / Switch with up to +15 dBm TX output
- High-speed 2 Mbps, long range, advertising extensions
- UART or USB
802.15.4
- IEEE 802.15.4-2015 compliant media access control (MAC)
- 802.15.4 supporting Zigbee and Matter over Thread in 2.4 GHz band
- SPI host Interfaces
Operating Systems
- Linux® OS
- FreeRTOS
Packaging
- 14.2x12mm flip‑chip chip‑scale package (FCCSP), 0.5 mm pitch; with antenna pin
- Fully integrated RF front end, crystal and passives in package
Temperature Range
- Industrial -40⁰C Ta to 105⁰C Tj